GE IS200CABPG1BAA Control Assembly Backplane
Description:
IS200CABPG1BAA is GE Control Assembly Backplane. IS200CABPG1BAA is a multi-layer printed wiring board, it provides the interconnections for the printed wiring boards inserted into it and interfaces to external signals. The boards inserted will vary with the powerlevel and application of the Innovation Series drive that the IS200CABPG1BAA board is part of. These boards are:
▪ IS200BAIA Bridge Interface Board (BAIA)
▪ IS215GBIA Auxiliary Genius Interface Module(GBIA), IS215PBIA Auxiliary Profibus InterfaceModule (PBIA),or IS200ACL Application Con-trol Layer Board (ACL )
▪ IS200DSPX Digital Signal Process Control Board(DSPX)(Optional)
▪ IS200RAPA Rack Power Supply Board (RAPA)
▪ IS200BIC Bridge Interface Board (BIC )
▪ IS200BPl Drive Bridge Personality InterfaceBoard (BPI )or IS200FOSA Bridge InterfaceBoard (FOSA)

IS200CABPG1BAA is also equipped with a full suite of connectors to support diverse external interfaces, including user control inputs and outputs (I/O), four front-panel meters, diagnostic and configuration tools, a front-panel keypad, four ISBus™ ports, and power supply inputs. IS200CABPG1BAA is secured to the Innovation Series board rack, which serves as the dedicated mounting framework for all individual circuit boards. 

IS200CABPG1BAA board draws power exclusively from the IS200HFPA High Frequency AC/Fan Power Supply Board (HFPA). Specifically, power is connected via a twisted and shielded pair cable for the 48 V AC supply, while a separate, isolated twisted pair cable handles the 17 V AC power. Both of these cables offer 1000 V DC isolation to ensure reliable operation.
For power return pathways, IS200CABPG1BAA connects isolated power returns to the control cabinet common (CCOM) — either through an impedance network (resistor/capacitor combination) or via a direct connection. Additionally, it links DCOM to CCOM to maintain system grounding consistency. Furthermore, provisions are included to connect cable shields directly to the chassis where applicable, enhancing electromagnetic compatibility.

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